رازداری کا بیان: آپ کی رازداری ہمارے لئے بہت اہم ہے۔ ہماری کمپنی وعدہ کرتی ہے کہ آپ کی واضح اجازتوں کے ساتھ آپ کی ذاتی معلومات کو کسی بھی ایکسپانی سے ظاہر نہ کریں۔
West-Bond
Establishment time : West-Bond was founded in 1966 and has been a leading manufacturer of bonding equipment for over 50 years.
website : www.westbond.com
Main Product : With a medium-sized workforce, West-Bond has the capacity to meet the demands of the semiconductor, microelectronics, and medical industries.
Company Profile
Palomar Technologies
Establishment time : 1975
website : www.palomartechnologies.com
Main Product : Die attach, wire bonding, and vacuum reflow systems
Company Profile
ASMPT (ASM Pacific Technology)
Establishment time : ASM Pacific Technology (ASMPT) was founded in 1975 and has since become a global leader in the semiconductor industry.
website :
Main Product : With a workforce of over 14,000 employees, ASMPT operates in key markets across Asia, Europe, and the Americas.
Company Profile
Kulicke & Soffa
Establishment time : Kulicke & Soffa Industries, Inc. is a leading provider of semiconductor and electronic assembly equipment.
website :
Main Product : Kulicke & Soffa's products are used in the production of a wide range of electronic devices, including smartphones, computers, and automotive components.
Company Profile
DIAS Automation
Establishment time : DIAS Automation was founded in 1990 and has since become a leading provider of industrial automation solutions.
website :
Main Product : DIAS Automation's main products include a wide range of automation solutions designed to improve efficiency and productivity in various industries.
Company Profile
Hybond
Establishment time : Hybond is a leading manufacturer of adhesives and sealants.
website :
Main Product : Our adhesives are used in a wide range of industries, including automotive and construction.
Company Profile
Hesse Mechatronics
Establishment time : Hesse Mechatronics is a leading provider of wire bonding equipment, specializing in advanced technology solutions for the semiconductor industry.
website :
Main Product : Hesse Mechatronics offers a range of wire bonding equipment, including ultrasonic and thermosonic bonders, wedge bonders, and heavy wire bonders.
Company Profile
Orthodyne Electronics
Establishment time : Orthodyne Electronics was founded in 1962 and has since been a leading provider of automated dispensing systems for adhesives and sealants.
website :
Main Product : The company offers a wide range of dispensing solutions to meet the diverse needs of its customers.
Company Profile
Laizhou Jinlida Machinery Co.,Ltd
Establishment time : 2003
website : www.jldepe.com
Main Product : EPE Foam Machine,Extruding Laminating Machine,Auto Cutting Machine,EPE Bonding Machine,EPE Recycling Machine,Baby Mat Making Machines
Company Profile
TPT Wire Bonder
Establishment time : TPT Wire Bonder is a leading manufacturer of wire bonding equipment for the semiconductor and microelectronics industries.
website :
Main Product : TPT Wire Bonder's products are known for their precision, reliability, and cutting-edge technology.
Company Profile
January 09, 2024
December 13, 2023
اس سپلائر کو ای میل کریں
January 09, 2024
December 13, 2023
September 09, 2024
رازداری کا بیان: آپ کی رازداری ہمارے لئے بہت اہم ہے۔ ہماری کمپنی وعدہ کرتی ہے کہ آپ کی واضح اجازتوں کے ساتھ آپ کی ذاتی معلومات کو کسی بھی ایکسپانی سے ظاہر نہ کریں۔
مزید معلومات کو پُر کریں تاکہ آپ کے ساتھ تیزی سے رابطہ ہوسکے
رازداری کا بیان: آپ کی رازداری ہمارے لئے بہت اہم ہے۔ ہماری کمپنی وعدہ کرتی ہے کہ آپ کی واضح اجازتوں کے ساتھ آپ کی ذاتی معلومات کو کسی بھی ایکسپانی سے ظاہر نہ کریں۔